Size and power breakthrough for high brightness LEDs

Danish-German technology company Hymite has announced a new silicon-based approach for volume production of high-brightness LEDs at low cost.

The company's new HyLED™ is a silicon-based packaging solution for high-brightness light emitting diodes (HB LEDs) in multiple markets.

HyLED enables miniaturization, cost-effective manufacturing and deployment of HB LED products across key industries where demand is high, from general lighting to mobile electronics, automotive lighting and panel backlighting, the company said.

A major European customer, which develops and produces high-performance digital light sources, is using HyLED and has apparently achieved good package miniaturization and power efficiencies.

“The primary challenge for HB LED manufacturers has been miniaturization and mass production of the components to meet market needs, while addressing unique thermal requirements and reducing the cost per lumen,” said Jochen Kuhmann, CTO and founder, Hymite. “HyLED silicon packaging overcomes these obstacles through wafer-scale production and assembly.”

The technology behind HyLED is silicon wafers and batch micromachining/metallization processes delivering package size reductions of up to 4x, Hymite claims. Proven IC-style automated manufacturing processes increase throughputs and yields for a lower cost per unit.

Hymite is a supplier of advanced wafer level products for electronics, micromechanical and optoelectronics components.

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